无铅化进程中助焊剂的改变

The changes of flux in the process of promoting lead-free soldering

摘要:

通过铺展试验，对助焊剂在有铅和无铅焊接中的铺展性及焊料的铺展外形和残留情况进行了比较，提出了从有铅向无铅工艺转变中助焊剂的改变思路，并制备了四种针对 Sn0.7 Cu 波峰焊接的助焊剂.其中无卤低固含量松香免清洗助焊剂的铺展率达到82，以上，无卤无松香低固含量免清洗助焊剂的铺展率达到83，以上，添加了卤素取代有机酸的助焊剂铺展率可达82，~89，，接近锡铅焊料的铺展性能.

Abstract:

By spreading tests as well as other flux performance tests and monitoring solder’s spreading appearance,residue condition,microstructure of welding spot,this paper examined flux’s performance on tin-lead soldering and lead-free soldering,respectively.In this paper,the author put forward a method to optimize flux for lead-free soldering and developed four kinds of wave soldering flux,which were fit for Sn0.7Cu.Among which the spreading rate of halogen-free low-solid no-clean rosin flux could reach over 82，,while the spreading rate of low-solid no-clean flux without halogen and rosin reached over 83，.The spreading rate of flux with halogen replacing organic acids varied in the range of 82， to 89，,which was comparable with the spreading performance of tin-lead solder.