合金元素 Ag 含量对 Sn-Ag-Cu无铅焊料焊接性能的影响

Effect of Ag concentration on soldering properties of Sn-Ag-Cu lead-free solder alloy

摘要:

探讨了合金元素 Ag 含量对 Sn-Ag-Cu 无铅合金焊料熔化温度、铺展性及润湿性的影响.结果表明,随着 Ag 含量的增加,Sn-Ag-Cu 合金焊料的熔化温度降低,铺展性和润湿性提高,当 w(Ag)≤0.5，时,Sn-0.7Cu 焊料与 Sn-0.5Ag-0.5Cu 焊料的焊接性能十分接近.

Abstract:

The paper has investigated that different amount of pure Ag are added into Sn-Ag-Cu lead-free solders,and the effect on soldering properties was also discussed.The results show that Ag can improve spreadability and wettability of Cu alloy further.When 0.5， of Ag added,both Sn-0.7Cu and Sn-0.5Ag-0.5Cu solder alloys exhibited similar properties.