导电PEDOT膜的液相沉降聚合及应用研究--全加成线路板制作的可行性

Synthesis of conducting PEDOT coating on PI film by depositional polymerization in EDOT solution and its application--Feasibility of PCB fabrication by full additive method

摘要:

为开发全加成PCB制作新工艺，将水解PI膜浸入H2O2和FeCl3溶液后再浸入EDOT溶液，研究EDOT原位聚合新方法，分析VUV辐射对PEDOT导电性的影响和在掩膜下制作导电图纹，以SEM揭示在导电PEDOT上电镀铜箔的形成．PI膜经H2O2和FeCl3溶液浸泡可引入mmol/m2量级的过氧基团和FeCl3，于EDOT溶液中与滞留层中的EDOT反应，形成PEDOT膜，使PI的表面电阻降至400Ω/□；VUV照射使PEDOT的导电性下降，可透过掩膜制作导电图纹；在电解池中导电PEDOT可传递电子使铜离子还原，沉积于导电PEDOT表面，形成针状晶核，再发育成枝晶、纺锤晶和连续铜箔，将导电图纹转化成铜线图纹．

Abstract:

To develop novel methods for conducting PEDOT coating and fully added PCB ,PI films were immersed in NaOH ,H2 O2 ,FeCl3 and EDOT solutions sequentially .The surface compositions and conduc-tivities of the PI films were examined .The effect of VUV irradiation on the conductivity was investigated and patterning PEDOT coatings was tried with VUV and mask .The growth of electroplated Cu foils on conducting PEDOT was revealed with SEM .After immersed in H2 O2 and FeCl3 solution ,peroxide and FeCl3 attached to PI at mmol/m2 .In EDOT solution the attached oxidants dissolved and converted EDOT to PEDOT in the stagnant layer and conducting PEDOT coatings generated on PI .The sheet resistance of the PI film could decrease to 400 Ω/□ .172 nm VUV reduced the conductivity and created conductive pat-terns through masks .In electrolytic cell ,conducting PEDOT could transport electrons to cupric ions and reduce the cupric ions to copper atoms .The reduced copper atoms deposited on the surface of conducting PEDOT ,forming nuclei and developing into acicular ,dendritic ,spindle crystals and continuous copper foil ,thereby ,conductive patterns were changed into copper patterns .