Ce元素添加量对Sn-Zn-Cu无铅合金焊料的焊接组织和性能的影响

Effect of Ce on microstructure and properties of Sn-ZnCu lead-free solder alloy

摘要:

研究了在适用于铜铝异种金属软钎焊的Sn-1.0Zn-0.7Cu无铅合金焊料中添加微量稀土元素Ce ，对合金焊料的钎焊组织和性能的影响。结果表明，当 w（Ce）＝0.10，时，可明显改善合金焊料对Al母材的润湿与铺展，提高焊点的可靠性。

Abstract:

Minute amount of rare earth Ce was added into Sn-1.0Zn-0.7Cu lead-free solder alloy aiming at examining the effect of properties and microstructure of Sn-1.0Zn-0.7Cu solder for forming a perfect sold-ered joint between Cu and Al .The results show that Ce can further improve wettability to Al-base and re-liability ,and when the content of Ce reached 0.10， ,it was the optimum composition .