Abstract:Fabrication of a strong cube texture Ni substrate through thermomechanical process is reported by ORNL research group. Decreasing the substrate thickness, the engineering critical current density will be improved. Rolled substrates are electropolished to the final thichness of 100, 80, 50, 40, and 20 μm, respectively. Electropolished substrates are recrystallized at temperatures between 800-1000C and in a mixed atmosphere of 4， H2 in 99.99， purity Ar. Orientation mappings of recrystallizated tapes are conducted through an EBSD system mounted on a LEO-1450 SEM. The influence of the substrate thickness on texture of the tape is studied in this paper. Results show that with the decrease of substrate thickness, the texture of the tapes with the same recrystallization process is more and more closed to the exact position of cube orientation.
