均热板热阻性能的研究现状

Research Status of Thermal Resistance Performance of Vapor Chamber

摘要:

随着电子产品更新换代速度的加快，对其性能的需求日益提升，因此推动了电子产品向微型化、高性能化方向发展。然而，微型化与高性能化通常伴随着热流密度的急剧增加，给散热设计带来了前所未有的挑战。在实际应用中，若电子产品产生的热量无法被及时有效地导出，不仅会显著降低其工作效能，极端情况下还会导致设备损坏。所以，高效散热技术成为了电子产品持续发展的关键瓶颈之一。近年来，均热板散热技术的应用已成为解决微型化电子产品高效散热问题的重要途径。为此，深入剖析了均热板散热技术的现状与发展趋势，详尽阐述其结构、工作原理及传热效能，构建全面框架体系。热阻性能作为衡量均热板散热效率的核心指标，其计算方法的解析对于实现高散热效率至关重要。为全面理解并提升均热板的热阻性能，系统阐述了影响热阻性能的两大因素：一是组成成分，主要包括吸液芯、外壳材料与工质，其中吸液芯类型与性能的研究是分析的重点；二是均热板工作时的外部环境条件，如热源特性、倾角、冷却条件等。这些外部因素的变化对均热板的热阻性能具有显著影响。最后，基于均热板的结构特性和技术发展趋势，展望了未来发展方向。(专精特新·特殊环境材料服役行为专辑十五之四)

Abstract:

With the accelerated replacement of electronic products， the demand for performance has also increased. This trend has significantly promoted the development of electronic products toward miniaturization and high performance. However， miniaturization and high performance are often accompanied by a sharp increase in the heat flux， which brings unprecedented challenges to thermal design. In practice， if the heat flux generated by electronic products cannot be dissipated promptly， it will not only lead to a significant decline in its performance， but may also lead to equipment damage in extreme cases. Therefore， efficient heat-dissipation technology has become a key bottleneck for the sustainable development of electronic products. In recent years， the applications of vapor chamber technology has become an important way to solve the problem of efficient heat dissipation in miniaturized electronic products. The purpose of this study is to analyze the current status and development trends of vapor chamber technology and to construct a comprehensive framework system by elaborating its structure， working principle， and heat transfer efficiency. In particular， the calculation method of thermal resistance， as a core indicator of the heat dissipation efficiency of a vapor chamber， is crucial for achieving high heat dissipation efficiency. To comprehensively understand and improve the thermal resistance performance of the vapor chamber， this study provides a systematic review of the factors affecting thermal resistance performance. These factors can be broadly categorized into two main groups. The first group is the composition of the vapor chamber， which mainly includes the wick， envelope material， and working medium. Among them， the wick， as a key structure affecting the thermal resistance， will be the focus of this paper， which examines current research status of its type and performance. The second group comprises the external environmental conditions during the work of the vapor chamber， such as the heat source characteristics， inclination angle and cooling conditions. Changes in these external factors significantly impact the thermal resistance of the plate. Therefore， their research is indispensable. Finally， based on the structural characteristics of the vapor chamber and the current technological development trends， future development directions are discussed.