均热板热阻性能的研究现状

Research status of thermal resistance performance of vapor chamber

摘要:

随着电子产品更新换代速度的加快，其对性能的需求也日益提升，这一趋势显著推动了电子产品向微型化、高性能化方向发展。然而，微型化与高性能化往往伴随着热流密度的急剧增加，给散热设计带来了前所未有的挑战。在实际应用中，若电子产品产生的热量无法被及时且有效地导出，不仅会导致其工作效能显著下降，极端情况下还可能引发设备损坏。因此，高效散热技术成为了电子产品持续发展的关键瓶颈之一。近年来，均热板散热技术的应用已成为解决微型化电子产品高效散热问题的重要途径。本文旨在深入剖析均热板散热技术的现状与发展趋势，通过详尽阐述其结构、工作原理及传热效能，构建一个全面的框架体系。特别地，热阻性能作为衡量均热板散热效率的核心指标，其计算方法的解析对于实现高散热效率至关重要。为了全面理解并提升均热板的热阻性能，本文将对影响热阻性能的因素进行系统综述。这些因素可大致归为两大类：一是均热板的组成成分，主要包括吸液芯、外壳材料与工质。其中，吸液芯作为影响热阻的关键结构，其类型与性能的研究现状将是本文分析的重点；二是均热板工作时的外部环境条件，如热源特性、倾角、冷却条件等。这些外部因素的变化对均热板的热阻性能具有显著影响，因此其研究同样不可或缺。最后，基于均热板的结构特性和当前技术发展趋势，对未来的发展方向进行了展望。

Abstract:

With the accelerated replacement of electronic products, the demand for performance has also increased, and this trend has significantly promoted the development of electronic products in the direction of miniaturization and high performance. However, miniaturization and high performance are often accompanied by a sharp increase in the heat flux, bringing unprecedented challenges to thermal design. In practice, if the heat flux generated by electronic products cannot be dissipated in time, it will not only lead to a significant decline in its performance, but in extreme cases may also lead to equipment damage. Therefore, efficient heat-dissipation technology has become a key bottleneck for the sustainable development of electronic products. In recent years, the application of vapor chamber technology has become an important way to solve the problem of efficient heat dissipation in miniaturized electronic products. The purpose of this study is to analyze the current situation and development trend of vapor chamber technology and to construct a comprehensive framework system by elaborating its structure, working principle, and heat transfer efficiency. In particular, the calculation method of thermal resistance, as a core indicator of the heat dissipation efficiency of a vapor chamber, is crucial for achieving high heat dissipation efficiency. To comprehensively understand and improve the thermal resistance performance of the vapor chamber, this study provides a systematic review of the factors affecting thermal resistance performance. These factors can be broadly categorized into two main groups. The first is the composition of the vapor chamber, which mainly includes the wick, envelope material, and working medium. Among them, the wick, as a key structure affecting the thermal resistance, the current research status of its type and performance will be the focus of analysis in this paper, and the external environmental conditions during the work of the vapor chamber, such as the heat source characteristics, inclination angle, cooling conditions, etc. Changes in these external factors have a significant impact on the thermal resistance of the plate; therefore, their research is indispensable. Finally, based on the structural characteristics of the vapor chamber and the current technological development trends, future development directions are discussed.