In this paper， the research status of Al2O3 ceramics bonded by oxide solder is reviewed. The general process and technological method of bonding Al2O3 ceramics with oxide solder are introduced. It mainly introduces the high-temperature oxide solder and low-temperature oxide solder used for Al2O3 ceramic bonding. The composition， joint organization， bonding temperature， joint shear strength and organizational change trend of the solder are summarized respectively. Finally， advantages and shortcomings of oxide solder are pointed out， aiming to provide a reference for the research focus and development direction of oxide solder bonding Al2O3 ceramics.
