化学机械抛光技术研究现状及发展趋势

The research status and development trends of chemical mechanical polishing

摘要:

综述了化学机械抛光技术的发展现状．介绍了化学机械抛光系统的组成及工作原理，着重阐述介绍了系统各部分的构成及作用，并对化学机械抛光未来的发展趋势作了展望．

Abstract:

The current development status of Chemical Mechanical Polishing （CMP） technology was reviewed in this paper. The principle of each important part of CMP was emphatically introduced，and the future development trend of CMP was also prospected.